BEST Inc. provides laser depaneling services for printed circuit board manufacturers in addition to EMS and OEMs. BEST’s numerous lasers are equipped to manage volumes from small prototype to large production runs. Laser depaneling can cut through plastics, ceramics and metals or some combination thereof. This is basically the right technique to use when you will find sharp corners or many tight radii of curvature inside the PCB Routing or perhaps in the flex circuit.
Depending on the material and also the part requirements, BEST laser services gives a tool-less part removal process in the form of final perforation, scoring and hold-in tabs. Utilizing a laser to do the depaneling gives the user the benefit of speed and positional accuracy. Unlike mechanical methods there is no part induced stresses, no tooling cost and no cutting oils or any other contaminants.
rigid flex depanelizedIn addition BEST may be that provider of laser depanelization once you have plenty of IoT devices which should be precisely machined or remove to fit perfectly straight into small mechanical enclosures.
Due to contact-free processing that proceeds with Laser PCB Depanelizer of printed circuit boards, there is little distortion even though thin materials are employed. When boards are milled or punched out employing a mechanical tool there could turn out to be a loss precision and potentially a distortion within the outside board dimensions. Even worse it may well crack solder joints when using these mechanical means. In BEST laser depanelization system feature fiducial registration and web-based scaling, which means already existing distortions may be compensated and the cut contours positioned precisely inside the layout.
Similar to scoring or v-grooves, laser perforations are another choice for singulated board removal from the panel or sheet. Perforations may be laser formed to any size and spacing to fulfill the specified removal and securement forces.
Laser scoring can make a limited depth ablation line in the panelized boards. In most cases the depth in the score lines are 50% of your material thickness and may be controlled to your desired depth. The scoring acts within a manner just like the hold-tab to secure the part in the panel or sheet, but allows for individual 19dexjpky to become ‘snapped’ out after processing. Laser scoring lines can also be used as being a deliberate path for crack propagation or stress relief. When performing the score lines as being a service BEST can either utilize the IPC guidelines or follow customer requirements.
Hold-in tabs are small uncut sections throughout the board which are utilized to secure the PCB Punching Machine inside the panel. The hold-in tabs can be used for easy handling small boards or even for printed circuit board securement for added processing. The hold-in tab width is chosen depending on the quantity of force desired to get rid of the part from your panel/sheet or known forces being applied by downstream processes like component loading. BEST laser services can make tabs in most board materials and to nearly any width and site in regards to the part.